The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are ...

Before package testing can begin, there are several items that need to be considered, including—but not limited to—cost, sample size, test method, and acceptance criteria. Arriving at the perfect ...

Natalie Finazzo is leading the firm's expansion. DDL Inc. (Minneapolis) is keeping pace with the growth of the packagetesting market by expanding to Boston. The company's package engineer, Natalie ...

The emphasis on heterogeneity is increasing the burden on OSATs and foundries to make sure everything works as expected inside a package. Putting a variety of chips or hardened IP blocks into a ...