Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

FuGasity Corp. today said it has received a notice of allowance for a patent from the U.S. Patent and Trademark Office. The patent would cover the Allen, Texas-based company’s technology for ...

Collaboration results in silicon-validated SP4T RF SOI switch reference flow using the Virtuoso Design Platform and integrated EM analysis Flow showcases advantages of a unified design environment for ...

Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

DOWNERS GROVE, Ill., Oct. 14, 2025 /PRNewswire/ -- Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, ...

The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...

DOWNERS GROVE, Ill., Oct. 29, 2025 /PRNewswire/ -- Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, ...