Abstract: Next-generation power modules require rigorous evaluation of insulating substrates due to increasing voltage levels and the associated risk of partial discharge (PD). PD typically occurs in ...
This repository accompanies Learn Java Fundamentals by Jeff Friesen (Apress, 2024). Download the files as a zip using the green button, or clone the repository to your machine using Git.
A Hermetic Conformal Coating Based High-Temperature Encapsulation Method for 250 °C SiC Power Module
Abstract: Featuring excellent material properties, silicon carbide (SiC) power devices emerge as the most promising candidates in high-temperature and high-power applications. However, existing ...
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