Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (FEM) ...
Nanoscale device employs magnetic tunnel junctions to convert thermal noise into binary signals for random number generation.
Abstract: A cylindrically periodic stratified media Green’s functions (CPSMGFs) method is proposed to analyze conformal arrays through one array unit. The CPSMGFs are developed on electric dyadic ...
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